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High-lead flip chip bump cracking on the thin organic substrate in a module package

✍ Scribed by J.W. Jang; L. Li; P. Bowles; R. Bonda; D.R. Frear

Book ID: 113800613
Publisher: Elsevier Science
Year: 2012
Tongue: English
Weight: 931 KB
Volume: 52
Category: Article
ISSN: 0026-2714
DOI: 10.1016/j.microrel.2011.09.024

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