High-frequency characterization of power/ground-plane structures
β Scribed by Guang-Tsai Lei; Techentin, R.W.; Gilbert, B.K.
- Book ID
- 114553432
- Publisher
- IEEE
- Year
- 1999
- Tongue
- English
- Weight
- 239 KB
- Volume
- 47
- Category
- Article
- ISSN
- 0018-9480
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π SIMILAR VOLUMES
## Abstract With the increase of operating frequency and circuitβcomponent density, signal/power integrity issues due to ground bounces become more important for highβspeed digital systems. This paper presents a modal analysis resulting in a multiport equivalent circuit model for the power/ground p
## Abstract This study presents an analytical model to calculate the stop band of the electromagnetic bandgap (EBG) materials embedded in PCB power/ground plane to mitigate power/ground plane noise. By treating the EBG structure as lumped elements at each unit, the currents flowing through the EBG