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Circuit modeling of power/ground plane structures for printed circuit boards

✍ Scribed by Chien-Chang Huang

Publisher
John Wiley and Sons
Year
2005
Tongue
English
Weight
90 KB
Volume
47
Category
Article
ISSN
0895-2477

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✦ Synopsis

Abstract

With the increase of operating frequency and circuit‐component density, signal/power integrity issues due to ground bounces become more important for high‐speed digital systems. This paper presents a modal analysis resulting in a multiport equivalent circuit model for the power/ground plane structures in printed circuit boards including effects of dielectric, conductor, and radiation losses. Numerical results represented in Z‐parameters verified by the measured data are shown to validate the proposed approach. Β© 2005 Wiley Periodicals, Inc. Microwave Opt Technol Lett 47: 97–99, 2005; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.21092

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