𝔖 Bobbio Scriptorium
✦   LIBER   ✦

High efficiency machining by high speed grinding — Application of camshaft

✍ Scribed by Keiji Shima; Fusao Nakajima; Tadayoshi Misumi; Akira Arakawa; Kazuhiko Kitanaka


Publisher
Elsevier Science
Year
1995
Tongue
English
Weight
159 KB
Volume
16
Category
Article
ISSN
0389-4304

No coin nor oath required. For personal study only.


📜 SIMILAR VOLUMES


High efficiency slicing of low resistanc
✍ W. Wang; Z.D. Liu; Z.J. Tian; Y.H. Huang; Z.X. Liu 📂 Article 📅 2009 🏛 Elsevier Science 🌐 English ⚖ 972 KB

As the semiconductor industry requires the cutting of silicon ingots into wafers, the slicing of large, ultra thin wafers is one of the main technologies to prevent wastage. Recently, apart from conventional inner diameter (ID) blade and multi-wire saw methods, wire electrical discharge machining (W