Heterogeneous Integrations

✍ Scribed by John H. Lau

Publisher: Springer Singapore
Year: 2019
Tongue: English
Leaves: 381
Edition: 1st ed.
Category: Library

No coin nor oath required. For personal study only.

✦ Synopsis

Heterogeneous integration uses packaging technology to integrate dissimilar chips, LED, MEMS, VCSEL, etc. from different fabless houses and with different functions and wafer sizes into a single system or subsystem. How are these dissimilar chips and optical components supposed to talk to each other? The answer is redistribution layers (RDLs). This book addresses the fabrication of RDLs for heterogeneous integrations, and especially focuses on RDLs on: A) organic substrates, B) silicon substrates (through-silicon via (TSV)-interposers), C) silicon substrates (bridges), D) fan-out substrates, and E) ASIC, memory, LED, MEMS, and VCSEL systems. The book offers a valuable asset for researchers, engineers, and graduate students in the fields of semiconductor packaging, materials sciences, mechanical engineering, electronic engineering, telecommunications, networking, etc.

✦ Table of Contents

Front Matter ....Pages i-xxii
Overview of Heterogeneous Integrations (John H. Lau)....Pages 1-59
Heterogeneous Integrations on Organic Substrates (John H. Lau)....Pages 61-80
Heterogeneous Integrations on Silicon Substrates (TSV-Interposers) (John H. Lau)....Pages 81-111
Heterogeneous Integrations on Silicon Substrates (Bridges) (John H. Lau)....Pages 113-139
Fan-Out Wafer/Panel-Level Packaging for Heterogeneous Integrations (John H. Lau)....Pages 141-191
Heterogeneous Integrations on Fan-Out RDL Substrates (John H. Lau)....Pages 193-204
Heterogeneous Integration of PoP (John H. Lau)....Pages 205-219
Heterogeneous Integration of Memory Stacks (John H. Lau)....Pages 221-256
Heterogeneous Integration of Chip-to-Chip Stacks (John H. Lau)....Pages 257-290
Heterogeneous Integration of CIS, LED, MEMS, and VCSEL (John H. Lau)....Pages 291-353
Trends in Heterogeneous Integrations (John H. Lau)....Pages 355-361
Back Matter ....Pages 363-368

✦ Subjects

Engineering; Electronics and Microelectronics, Instrumentation; Circuits and Systems; Electronic Circuits and Devices

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