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Heat Effects upon Electrochemical Copper Deposition on Polycrystalline Gold

✍ Scribed by Kai D. Etzel; Katrin R. Bickel; Rolf Schuster

Publisher: John Wiley and Sons
Year: 2010
Tongue: English
Weight: 267 KB
Volume: 11
Category: Article
ISSN: 1439-4235
DOI: 10.1002/cphc.200900981

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