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Heat-conducting adhesives based on modified epoxy resins

✍ Scribed by S. N. Gladkikh; L. I. Kuznetsova; L. I. Naumova; A. I. Vyalov

Book ID
111473714
Publisher
Pleiades Publishing
Year
2009
Tongue
English
Weight
94 KB
Volume
2
Category
Article
ISSN
1995-4212

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Adhesives and coatings based on phenolic
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✍ A. M. Motawie; E. M. Sadek πŸ“‚ Article πŸ“… 1999 πŸ› John Wiley and Sons 🌐 English βš– 109 KB

Low molecular weight epoxy resin based on bis (4hydroxy phenyl) 1,1 cyclohexane was prepared and modified with various types of the prepared phenolic resins. PhenolΒ±, cresolΒ±, resorcinolΒ±and salicylic acidΒ± formaldehyde resins were used. The optimum conditions of formulation and curing process were