Handbook of 3D Integration || Multiproject Circuit Design and Layout in Lincoln Laboratory's 3D Technology

Electrical Modeling and Design for 3D Sy

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Macromodeling of Complex Interconnects in 3D Integration

✍ Li, Er-Ping 📂 Article 📅 2012 🏛 John Wiley & Sons, Inc. 🌐 English ⚖ 715 KB

**New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems** Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity a

Electrical Modeling and Design for 3D Sy

Electrical Modeling and Design for 3D System Integration (3D Integrated Circuits and Packaging, Signal Integrity, Power Integrity and EMC) || Modeling of Through-Silicon Vias (TSV) in 3D Integration

✍ Li, Er-Ping 📂 Article 📅 2012 🏛 John Wiley & Sons, Inc. 🌐 English ⚖ 326 KB

**New advanced modeling methods for simulating the electromagnetic properties of complex three-dimensional electronic systems** Based on the author's extensive research, this book sets forth tested and proven electromagnetic modeling and simulation methods for analyzing signal and power integrity a

[IEEE 2007 IEEE Radio Frequency Integrat

[IEEE 2007 IEEE Radio Frequency Integrated Circuits Symposium - Honolulu, HI, USA (2007.06.3-2007.06.5)] 2007 IEEE Radio Frequency Integrated Circuits (RFIC) Symposium - Design and Layout Techniques for the Optimization of nMOS SPDT Series-Shunt Switches in a 130nm SiGe BiCMOS Technology

✍ Comeau, Jonathan P.; Cressler, John D.; Mitchell, Mark 📂 Article 📅 2007 🏛 IEEE ⚖ 401 KB

The influence of 3d transition metal sub

The influence of 3d transition metal substitution on the magnetic properties of MnGaGe : J.B. Goodenough, Lincoln Laboratory, Massachusetts Institute of Technology, Lexington, Massachusetts, U.S.A., and G.B. Street, K. Lee, and J.C. Suits, IBM Research Laboratory, San Jose, California, U.S.A.

📂 Article 📅 1974 🏛 Elsevier Science 🌐 English ⚖ 100 KB

[IEEE 2010 10th IEEE International Confe

[IEEE 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology (ICSICT) - Shanghai, China (2010.11.1-2010.11.4)] 2010 10th IEEE International Conference on Solid-State and Integrated Circuit Technology - Processing material evaluation and ultra-wideband modeling of through-strata-via (TSV) in 3D integrated circuits and systems

✍ Xu, Zheng; Beece, Adam; Zhang, Dingyou; Chen, Qianwen; Rose, Kenneth; Lu, James 📂 Article 📅 2010 🏛 IEEE ⚖ 548 KB

Amplification and deregulated expression

Amplification and deregulated expression of cyclin D1 in human tumors: G. Peters, S. Bates, D. Parry, S. Brookes, V. Fantl, R. Smith and C. Dickson. Imperial Cancer Research Fund Laboratories, 44 Lincoln's Inn Fields, London WC2A 3PX, U.K.

📂 Article 📅 1994 🏛 Elsevier Science 🌐 English ⚖ 91 KB