The effect of the distribution of voids over a grain boundary facet, on the void growth process, has been modelled. Assuming the grains to behave as rigid slabs which move apart during cavitation at a uniform rate, any non-uniformity of void spacing results in stress redistribution over the facet. T
Growth of voids in metals during diffusion and creep
β Scribed by R.W Balluffi; L.L Seigle
- Publisher
- Elsevier Science
- Year
- 1957
- Weight
- 822 KB
- Volume
- 5
- Category
- Article
- ISSN
- 0001-6160
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