Growth kinetics and size distribution of intermetallic compound grains in soldering reaction based on separate measurements of grain radius and height

✍ Scribed by Hee-Soo Kim; Yong Sun Won; Young Hoon Kwak

• Book ID: 113898132
• Publisher: Elsevier Science
• Year: 2010
• Tongue: English
• Weight: 260 KB
• Volume: 62
• Category: Article
• ISSN: 1359-6462
• DOI: 10.1016/j.scriptamat.2009.09.017