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Growth Behavior of Intermetallic Compounds at SnAgCu/Ni and Cu Interfaces

✍ Scribed by Lihua Qi; Jihua Huang; Hua Zhang; Xingke Zhao; Haitao Wang; Donghai Cheng


Book ID
107458479
Publisher
Springer US
Year
2009
Tongue
English
Weight
593 KB
Volume
19
Category
Article
ISSN
1059-9495

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