✦ LIBER ✦

Grain Growth, Stress, and Impurities in Electroplated Copper

✍ Scribed by Brongersma, S. H.; Kerr, E.; Vervoort, I.; Saerens, A.; Maex, K.

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Anisotropy of grain boundary energies as

✍ Jong-Min Paik; Young-Joon Park; Min-Seung Yoon; Je-Hun Lee; Young-Chang Joo 📂 Article 📅 2003 🏛 Elsevier Science 🌐 English ⚖ 229 KB

Grain-size stabilization by impurities a

✍ D.S. Gianola; B.G. Mendis; X.M. Cheng; K.J. Hemker 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 495 KB

In situ transmission electron microscope

✍ Hau-Riege, Stefan P.; Thompson, Carl V. 📂 Article 📅 2000 🏛 American Institute of Physics 🌐 English ⚖ 577 KB

Grain growth in copper and alpha-brasses

✍ I. M. Ghauri; M. Z. Butt; S. M. Raza 📂 Article 📅 1990 🏛 Springer 🌐 English ⚖ 264 KB

Grain growth in copper interconnect line

✍ W. Wu; D. Ernur; S.H. Brongersma; M. Van Hove; K. Maex 📂 Article 📅 2004 🏛 Elsevier Science 🌐 English ⚖ 392 KB

The impurity-drag effect and grain growt

✍ R.J. Brook 📂 Article 📅 1968 🏛 Elsevier Science ⚖ 118 KB