Grain boundary structure of nanocrystalline Cu processed by cryomilling

✍ Scribed by Huang, J. Y.; Liao, X. Z.; Zhu, Y. T.; Zhou, F.; Lavernia, E. J.

• Book ID: 126981799
• Publisher: Taylor and Francis Group
• Year: 2003
• Tongue: English
• Weight: 719 KB
• Volume: 83
• Category: Article
• ISSN: 1478-6435
• DOI: 10.1080/1478643031000083633