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Grain boundary sliding of copper in the rolling process

โœ Scribed by J.H. Dautzenberg; J.H. Zaat

Publisher
Elsevier Science
Year
1974
Tongue
English
Weight
577 KB
Volume
29
Category
Article
ISSN
0043-1648

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๐Ÿ“œ SIMILAR VOLUMES

The kinetics of grain boundary grooving
The kinetics of grain boundary grooving in copper
โœ W.W. Mullins; P.G. Shewmon ๐Ÿ“‚ Article ๐Ÿ“… 1959 ๐Ÿ› Elsevier Science โš– 843 KB

In an earlier paper the diffusion equation associated with grain boundary grooving was solved and it was concluded that surface diffusion was the dominant transport mechanism for copper. For this mechanism the theory predicts that the shape of the groove profile has a time independent form and that