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Grain-boundary hardening in polycrystalline copper-based solid solutions

✍ Scribed by G. P. Bakach; L. A. Kornienko; E. F. Dudarev


Book ID
112428533
Publisher
Springer
Year
1984
Tongue
English
Weight
386 KB
Volume
27
Category
Article
ISSN
1573-9228

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Grain boundary strengthening of copper-b
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AbstractÐThe yield strength s y of copper-base copper±manganese and copper±gallium polycrystalline solid solutions has been measured as a function of the grain size d. X-ray diraction studies proved that the specimens had only very weak textures. The function s y (d) is well represented by the Hall±