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Global interconnect width and spacing optimization for latency, bandwidth and power dissipation

✍ Scribed by Xiao-Chun Li; Jun-Fa Mao; Hui-Fen Huang; Ye Liu

Book ID: 114617980
Publisher: IEEE
Year: 2005
Tongue: English
Weight: 678 KB
Volume: 52
Category: Article
ISSN: 0018-9383
DOI: 10.1109/ted.2005.856795

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