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Full-wave characterization of a through hole via in multi-layered packaging

✍ Scribed by Show-Gwo Hsu; Ruey-Beei Wu

Book ID: 114552301
Publisher: IEEE
Year: 1995
Tongue: English
Weight: 830 KB
Volume: 43
Category: Article
ISSN: 0018-9480
DOI: 10.1109/22.382068

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