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Friction-reducing properties of stearic acid modification of the Cu2S film on the copper substrate

✍ Scribed by Wang, Yinhu; Wan, Yong; Wang, Weixu; Yang, Shuyan

Book ID: 122833170
Publisher: Elsevier Science
Year: 2013
Tongue: English
Weight: 914 KB
Volume: 557
Category: Article
ISSN: 0925-8388
DOI: 10.1016/j.jallcom.2012.12.101

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