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Fracture toughness characterization of brittle thin films

✍ Scribed by L.S. Fan; R.T. Howe; R.S. Muller

Publisher: Elsevier Science
Year: 1990
Tongue: English
Weight: 743 KB
Volume: 23
Category: Article
ISSN: 0924-4247
DOI: 10.1016/0924-4247(90)87049-o

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✦ Synopsis

This paper describes the design and fabrication of a series of test structures for measuring the fracture toughness of brittle thin films, with application to low-pressure chemical-vapor-deposited (LPCVD) Si3N4 and low-stress, silicon-rich LPCVD SixNy. Crack-initiating features are patterned in clamped-clamped microbridges, which are loaded in tension after release from the substrate due to the tensile residual stress in the nitride films. Initial measurements yield an upper bound Kic< 14MPam ~/2 for Si3N4 and Kic = 1.8+ 0.3 MPa m t/2 for low-stress nitride, using typical values for the residual stress.

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