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Fracture prediction of dissimilar thin film materials in Cu/low-k packaging

✍ Scribed by Chang-Chun Lee; Chien-Chen Lee; Ya-Wen Yang

Book ID: 106398493
Publisher: Springer US
Year: 2009
Tongue: English
Weight: 782 KB
Volume: 21
Category: Article
ISSN: 0957-4522
DOI: 10.1007/s10854-009-9994-0

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