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Fracture mechanics analysis on Smart-Cut®technology. Part 2: Effect of bonding flaws

✍ Scribed by Bin Gu; Hongyuan Liu; Yiu-Wing Mai; Xi Qiao Feng; Shou Wen Yu

Book ID
106331886
Publisher
The Chinese Society of Theoretical and Applied Mechanics; Institute of Mechanics, Chinese Academy of Sciences
Year
2008
Tongue
English
Weight
350 KB
Volume
25
Category
Article
ISSN
0567-7718

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✍ Bin Gu; Hong-Yuan Liu; Yiu-Wing Mai; Xi-Qiao Feng; Shou-Wen Yu 📂 Article 📅 2008 🏛 Elsevier Science 🌐 English ⚖ 567 KB

Annealing temperature is very critical in the Smart-Cut process especially when material mismatch exists. Experiments have shown that high temperature along with thermal mismatch may fail the Smart-Cut process by inducing severe deformation or cracks on the films. The present paper, following our pr