Forming solder joints by sintering eutectic tin-lead solder paste

✍ Scribed by Mark A. Palmer; Christy N. Alexander; Brian Nguyen

• Book ID: 107458021
• Publisher: Springer US
• Year: 1999
• Tongue: English
• Weight: 575 KB
• Volume: 28
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-999-0219-3