Forming high temperature solder joints through liquid phase sintering of solder paste

✍ Scribed by Mark A. Palmer; Nicole S. Erdman; David A. McCall

• Book ID: 107457961
• Publisher: Springer US
• Year: 1999
• Tongue: English
• Weight: 583 KB
• Volume: 28
• Category: Article
• ISSN: 0361-5235
• DOI: 10.1007/s11664-999-0156-1