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Formation and characterization of low resistivity sub-100 nm copper films deposited by electroless on SAM

✍ Scribed by T. Asher; A. Inberg; E. Glickman; N. Fishelson; Y. Shacham-Diamand

Book ID: 108119392
Publisher: Elsevier Science
Year: 2009
Tongue: English
Weight: 661 KB
Volume: 54
Category: Article
ISSN: 0013-4686
DOI: 10.1016/j.electacta.2009.02.089

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