Rockport Publishers, Inc., 2010. β 209 p. β ISBN-10: 1592536034, ISBN-13: 978-1592536030.<br/>ΠΠ° Π°Π½Π³Π». ΡΠ·ΡΠΊΠ΅.<div class="bb-sep"></div><strong>This book outlines and demonstrates basic package design guidelines and rules through 100 principles in the areas of research, planning, and execution. This
Format for LSI-Package-Board interoperable design
- Leaves
- 208
- Category
- Scientific
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<P><STRONG><EM>Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging</EM></STRONG> presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and
<p><strong><em>Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging</em></strong> presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and
This book outlines and demonstrates basic package design guidelines and rules through 100 principles in the areas of research, planning, and execution. This book is a quick reference and primer on package design, and the principles that make design projects successful. Highly visual and appealing to