Cover
Half Title
Series Page
Title Page
Copyright Page
Contents
Preface
About the Series Editor
About the Editor
Contributors
1. Flexible, Wearable, and Stretchable Electronics
CONTENTS
1.1. Introduction
1.2. Functional Electronic Components and Devices
1.3. Thin Film Transistors (TFTs)
1.3.1. Carbon Nanotube-Based TFTs
1.3.2. Organic TFTs
1.4. Displays
1.5. Sensors
1.5.1. Gases and Light Signals
1.5.2. Miscellaneous Signals
1.6. Batteries
1.7. Bio-Integrated Electronics
1.7.1. Healthcare-Monitoring Devices
1.7.2. Human-Machine Interfaces
1.8. Conclusions and Future Outlook
Acknowledgments
References
2. Stretchable Conductor
CONTENTS
2.1. Introduction
2.2. Materials
2.2.1. Substrate Materials
2.2.2. Conductive Materials
2.2.2.1. Silver Nanomaterials
2.2.2.2. Gold Nanomaterials
2.2.2.3. Copper Nanomaterials
2.2.2.4. Liquid Metal
2.2.2.5. Carbon Nanotubes
2.2.2.6. Graphene
2.2.2.7. Conducting Polymers
2.3. Stretchable Structures
2.3.1. Percolation Networks
2.3.2. Buckled Structures
2.3.3. Nanomeshes
2.3.4. Serpentine Structures
2.3.5. Helix Structures
2.4. Applications
2.4.1. Interconnects
2.4.2. Sensors
2.4.3. Energy-Storage Devices
2.4.4. Actuators
2.4.5. Heaters
References
3. Components and Devices
CONTENTS
3.1. Introduction
3.2. Electrical Components and Circuits
3.2.1. Conductive Traces
3.2.1.1. Principles, Materials and Fabrication
3.2.1.2. Examples
3.2.2. Resistors
3.2.2.1. Principles, Materials and Fabrication
3.2.2.2. Examples
3.2.3. Capacitors
3.2.3.1. Principles, Materials and Fabrication
3.2.3.2. Examples
3.2.4. Transistors
3.2.4.1. Principles, Materials and Fabrication
3.2.4.2. Examples
3.2.5. Integrated Circuits
3.2.5.1. Principles, Materials and Fabrication
3.2.5.2. Examples
3.3. Photovoltaics
3.3.1. Background
3.3.2. Organic Photovoltaics
3.3.2.1. Principles, Materials and Fabrication
3.3.2.2. Examples
3.3.3. Summary
3.4. Luminescent Devices
3.4.1. Background
3.4.2. ACEL
3.4.2.1. Principles, Materials and Fabrication
3.4.2.2. Examples
3.4.3. OLED
3.4.3.1. Principles, Materials and Fabrication
3.4.3.2. Examples
3.4.4. Summary
3.5. Conclusions
Bibliography
4. Printing Techniques
CONTENTS
4.1. Introduction
4.2. Evolution of Printing
4.2.1. Development of Printing Processes for Information Sharing
4.2.2. Development of Printing Processes for Visual Mass Communication
4.2.3. Development of Printing Processes as an Additive Manufacturing Technique
4.3. The Graphic Chain versus the Functional Chain
4.3.1. Prepress: File Preparation and Supplies Selection
4.3.2. Press Configuration and Terminology
4.3.3. Manufacturing Processes
4.4. Printability
4.4.1. Control of Rheological Properties
4.4.2. Control of Interfacial Properties
4.4.2.1. Models
4.4.2.2. Applications
4.5. Ink Formulation
4.5.1. Inks for PE, Graphics, and Slurries
4.5.2. Raw Material Selection
4.5.2.1. Percolation Threshold and Aspect Ratio
4.5.2.2. Active Material Selection
4.5.2.3. Vehicle Composition and Material Selection
4.5.3. From a Stable Dispersion/Solution to an Ink
4.6. Drying
4.6.1. Solidification Mechanisms
4.6.2. Layer Functionalization
4.7. Printing Processes for PE Manufacturing
4.7.1. Versatile Processes
4.7.1.1. Principle of Ink-Jet Printing
4.7.1.2. Principle of Flat-Bed Screen Printing
4.7.2. Specialized Rotary Processes
4.7.2.1. Principle of Rotary Screen Printing
4.7.2.2. Principle of Flexography
4.7.2.3. Principle of Gravure Printing
4.7.3. A Comparison of Printing Processes
4.8. Industrialization Challenges
Acknowledgments
Reference
5. Carbon Nanotube-Based Flexible Electronics
CONTENTS
5.1. Introduction
5.2. CNT-Based Flexible TFTs
5.3. CNT-Based Flexible CMOS Circuits
5.4. CNT-Based Flexible Sensors
5.5. Conclusions and Outlook
References
6. Flexible Sensor Sheets for Healthcare Applications
CONTENTS
6.1. Introduction
6.2. Flexible Physical Healthcare Device Patches
6.2.1. Printed Flexible Three-Axis Acceleration Sensors
6.2.2. ECG and Skin Temperature Sensors
6.2.3. Multifunctional Sensor Sheet Demonstration
6.3. Flexible Chemical Healthcare Devices
6.3.1. Charge-Coupled Device (CCD)-Based Flexible pH Sensor
6.3.2. Highly Sensitive Real-Time pH Monitoring
6.4. Summary and Outlook
References
7. Controlled Spalling Technology
CONTENTS
7.1. Introduction
7.2. History and Theoretical Basis of Controlled Spalling Technology
7.3. Application in Wearable Electronics
7.3.1. Materials and Fabrication Processes
7.3.2. Example of Flexible Piezoresistive Sensor: Wearable Fingernail Sensor
7.4. Other Applications of Controlled Spalling Technology
7.4.1. Application in Photovoltaic Technology
7.4.2. Application for Other Electronic Devices and Materials
7.5. Outlook
Acknowledgments
References
8. Flexible and Stretchable Liquid Metal Electronics
CONTENTS
8.1. Introduction
8.2. Scope
8.3. The Need for Liquid Metals in Soft Electronics
8.4. How to Pick a Liquid Metal?
8.4.1. Mercury (Hg)
8.4.2. Cesium, Francium, and Rubidium
8.4.3. Gallium (Ga)
8.5. Properties of Gallium-Based Liquid Metal Alloys
8.5.1. Role of Oxide Skin on Gallium-Based Liquid Metals
8.6. Techniques to Pattern Gallium-Based Liquid Metals
8.6.1. Lithography-Assisted
8.6.2. Injection
8.6.3. Additive
8.6.4. Subtractive
8.7. Applications of Gallium-Based Liquid Metals in Soft Electronics
8.7.1. Stretchable Interconnects, Antennas, and Self-Healing Conductors
8.7.2. Soft Sensors
8.7.2.1. Strain Measurement
8.7.2.2. Pressure and Touch Detection
8.7.3. Soft Composite Devices
8.7.4. Reconfigurable Electronics
8.8. Outlook: Opportunities and Challenges
8.8.1. Mechanics
8.8.2. Electrical Contacts
8.8.3. Toxicity
8.8.4. Cost
8.8.5. Electrical Conductivity
8.8.6. Scalability, Stretchability, and Reconfigurability
8.8.7. Resolution
8.8.8. Oxide Wetting Properties
8.9. Summary
Acknowledgments
References
9. Advanced Flexible Hybrid Electronics (FHE)
CONTENTS
9.1. Flexible vs. Rigid Electronics
9.2. Flexible Hybrid Electronics (FHE)
9.3. Advanced FHE: Concept and Fabrication
9.4. Advanced FHE: Characterization and Application
9.5. Summary
Acknowledgment
References
10. Metal-Laminated Fabric Substrates and Flexible Textile Interconnection
CONTENTS
10.1. Introduction
10.2 Fine-Pitch Metal-Laminated Fabric Substrates Using B-Stage Non-Conductive Films (NCFs)
10.2.1. Materials and Fabrication Processes
10.2.2. NCFs Curing Property Optimization
10.2.3. Effects of NCFs Viscosities on the Fabric Substrates Morphology
10.2.4. Metal Surface Finish of Cu Electrodes on the B-Stage NCFs
10.3. Flexibility of the Fabric Substrates
10.3.1. Bending Stress Analysis of the Metal Pattern on Fabric Substrates
10.3.2. Bending Fatigue Test Results
10.3.3. Improvement of Bending Fatigue Life by Adhesion Enhancement
10.4. ACFs Interconnection of the Fabric Substrates: Chip On Fabric (COFa)
10.4.1. Materials and Test Vehicles
10.4.2. Fabrication and Evaluation of COFa Using ACFs
10.4.3. Flexibility of COFa with the Cover Layer Structure
10.4.5. Reliability of the Optimized COFa
10.5. Conclusion
References
11. Flexible and Stretchable Systems for Healthcare and Mobility
CONTENTS
11.1. Introduction
11.2. Core Technologies for Flexible/Stretchable System Integration
11.2.1. Ultrathin Flexible Circuits and Systems by Laser-Assisted Debonding
11.2.2. Stretchable Circuits and Systems
11.2.3. Conformally Integrated Electronics
11.3. Application Examples
11.4. Summary and Outlook
References
12. Fabrication of Transparent Antennas on Flexible Glass
CONTENTS
12.1. Introduction
12.2. Background
12.3. Indium Tin Oxide Transparent Antenna on Flexible Glass
12.3.1. Fabrication
12.3.2. Design
12.3.3. Fabrication Method
12.3.4. Testing and Evaluation
12.4. Copper Mesh Antennas on Flexible Glass
12.4.1. Fabrication Etch Process
12.4.2. Fabrication Semi Additive
12.4.3. Testing and Evaluation
12.4.3.1. On-Vehicle Testing
12.5. Discussion and Conclusion
References
13. Testing and Reliability Characterization Methods for Flexible Hybrid Electronics
CONTENTS
13.1. Flexure Reliability of Flexible Hybrid Electronics (FHE)
13.1.1. Specimen Dimensions and Test Conditions
13.1.2. Effect of Sintering Temperature on Flexure Reliability
13.1.3. Effect of Sintering Temperature on Shear Load to Failure
13.1.4. Cyclic Flexure Accelerated Tests
13.1.4.1. Samples Sintered at 150°C for 1 H
13.1.4.2. Samples Sintered at 200°C for 1 H
13.1.4.3. Samples Sintered at 250°C for 1 H
13.1.4.4. Samples Sintered at 300°C for 1 H
13.1.5. Comparison of the Flexure Reliability versus Sintering Conditions
13.1.6. Optical Images for Various Sintering Conditions
13.1.7. Scanning Electron Microscope (SEM) images
13.2. Stretching Reliability of FHE
13.2.1. Test Vehicle
13.2.2. Data on Stretch Testing of FHE
13.2.2.1. Stress Relaxation Test
13.2.2.2. Stretch Results
13.2.2.3. Resistance and Displacement Response
13.2.2.4. Comparison of Strain Levels
13.3. Summary and Conclusions
Acknowledgments
References
Index