Flexible and Stretchable Electronics: Materials, Design, and Devices

✍ Scribed by Run-wei Li (editor), Gang Liu (editor)

• Publisher: Pan Stanford Publishing Pte Ltd
• Year: 2019
• Tongue: English
• Leaves: 409
• Category: Library

✦ Synopsis

With the recently well developed areas of Internet of Thing, consumer wearable gadgets and artificial intelligence, flexible and stretchable electronic devices have spurred great amount of interest from both the global scientific and industrial communities. As an emerging technology, flexible and stretchable electronics requires the scale-span fabrication of devices involving nano-features, microstructures and macroscopic large area manufacturing. The key factor behind covers the organic, inorganic and nano materials that exhibit completely different mechanical and electrical properties, as well as the accurate interfacial control between these components. Based on the fusion of chemistry, physics, biology, materials science and information technology, this review volume will try to offer a timely and comprehensive overview on the flexible and stretchable electronic materials and devices. The book will cover the working principle, materials selection, device fabrication and applications of electronic components of transistors, solar cells, memories, sensors, supercapacitors, circuits and etc.

✦ Table of Contents

Cover
Half Title
Title Page
Copyright Page
Table of Contents
Preface
1: Organic Field-Effect Transistors for Flexible Electronics Application
1.1 Introduction
1.2 Device Structures and Operation Principle
1.3 Important Device Parameters
1.3.1 Field-Effect Mobility
1.3.2 Current ON/OFF Ratio
1.3.3 Threshold Voltage
1.3.4 Subthreshold Swing
1.4 Materials
1.4.1 Organic Semiconductors
1.4.1.1 p-Type
1 .4.1.2 n-Type
1.4.2 Gate Dielectric Materials
1.4.3 Electrode Materials
1.4.4 Substrate Materials
1.5 Overview of Processing Techniques
1.5.1 Vacuum Deposition
1.5.2 Solution-Processed Deposition
1.6 Flexible Organic Transistor Device
1.7 Flexible Organic Phototransistor
1.7.1 Introduction
1.7.2 Important Device Parameters of Organic Phototransistor
1.7.2.1 Photoconductive gain (G)
1.7.2.2 Photocurrent/dark current ratio (P)
1.7.2.3 Photosensitivity (R)
1.7.2.4 Quantum efficiency (n)
1.7.2.5 Photodetectivity (D*)
1.7.3 Examples of Flexible Organic Phototransistors
1.7.3.1 Donor-acceptor system
1.7.3.2 Photochromism
1.7.3.3 Photopolymerization
1.8 Conclusion
2: Flexible and Organic Solar Cells
2.1 Introduction
2.2 Basic Solar Cell Concepts
2.2.1 Structure of Organic Solar Cells
2.2.2 Operation Principle of Organic Solar Cells
2.2.3 Photovoltaic Parameters
2.3 Donor Materials Development
2.3.1 Conjugated Polymers
2.3.2 Conjugated Small Molecules
2.4 Acceptor Materials Development
2.4.1 Fullerene Derivatives
2.4.2 Non-fullerene Small Molecules
2.5 Interfacial Materials and Device Engineering
2.6 Flexible and Organic Solar Cells
3: Flexible Parylene-C Material and Its Applications in MOSFETs, RRAMs, and Sensors
3.1 An Introduction to Parylene
3.1.1 Types and Growth of Parylene Thin Films
3.1.2 Properties of Parylene-C Thin Films
3.2 Application of Parylene-C in MOSFETs
3.2.1 Gate Dielectric
3.2.2 Substrate
3.2.3 Encapsulation Gate Dielectric
3.3 Application of Parylene-C in RRAM
3.4 Application of Parylene-C in Sensors
3.4.1 Flow Sensors
3.4.2 pH Sensors
3.4.3 Force Sensors
3.4.4 Pressure Sensors
3.5 Conclusion
4: Resistive Switching Phenomenon for Flexible and Stretchable Memories
4.1 Introduction
4.2 Design Principle of Flexible Resistive Switching Memory
4.3 Flexible Resistive Switching Storage Media Materials
4.3.1 Inorganic Materials
4.3.2 Organic Materials
4.3.2.1 Organic resistive switching memory with small molecules
4.3.2.2 Blends or mixtures of memory polymer Materials
4.3.2.3 Polymer matrices for electroactive components
4.3.2.4 Single-component polymer active Materials
4.3.3 Inorganic-Organic Hybrid Materials
4.3.3.1 Metal-organic frameworks
4.3.3.2 Perovskite
4.4 Conclusion and Outlook
5: Two-Dimensional Materials for Flexible In-Plane Micro-Supercapacitors
5.1 Introduction
5.2 In-Plane Micro-Supercapacitors
5.3 Graphene
5.3.1 Reduced Graphene Oxide
5.3.2 Electrochemically Exfoliated Graphene
5.3.3 Laser-Scribed Graphene
5.3.4 Graphene Composites
5.4 MXenes
5.5 Two-Dimensional Metal Oxides
5.5.1 Layered Double Hydroxides
5.5.2 V2O5/MWNT
5.6 Two-Dimensional Soft Materials
5.6.1 Two-Dimensional Coordination Polymer Framework
5.6.2 Two-Dimensional Thiophene
5.7 Summary and Outlook
6: Flexible On-Chip Interdigital Micro-Supercapacitors: Efficient Power Units for Wearable Electronics
6.1 Introduction
6.2 Fabrication Methods
6.2.1 Conventional Photolithography Method
6.2.2 Laser-Scribing Method
6.2.3 Printing Method
6.3 Stretchable On-Chip MSCs
6.4 Integrated Systems
6.5 Conclusion
7: Flexible and Stretchable Sensors
7.1 Introduction
7.2 Classes of Architectural Strategies for Flexible and Stretchable Sensors
7.2.1 One-Dimensional Fibrous Configuration
7.2.2 Two-Dimensional Planar Configuration
7.2.3 Three-Dimensional Blocks Configuration
7.2.4 Nature-Inspired Structure for Flexibility and Stretchability
7.3 Classes of Functional Materials for Flexible and Stretchable Sensors
7.3.1 One-Dimensional Nanowire Materials
7.3.2 Two-Dimensional Planar Materials
7.3.3 Semiconductors
7.3.4 Other Special Functional Materials
7.4 Flexible and Stretchable Sensors for Human Information Detection
7.5 Conclusion
8: Liquid Metal-Enabled Functional Flexible and Stretchable Electronics
8.1 Introduction
8.2 Materials and Properties of Gallium-Based RTLMs
8.2.1 Compositions of Gallium-Based RTLM Alloys
8.2.2 Basic Properties of LMs in Flexible Electronics
8.3 Design and Fabrication of LM Flexible Electronics
8.3.1 Planar Electronics Printing
8.3.2 3D Printing
8.4 Applications: LM Soft Devices
8.4.1 LM Sensor
8.4.2 LM Coil
8.4.3 LM e-Skin and Wearable Bioelectronics
8.4.4 LM-Conformable Electronics
8.4.5 Other Applications
8.5 Discussion and Conclusion
9: Printing Technology for Fabrication of Flexible and Stretchable Electronics
9.1 Introduction
9.2 Printing Process
9.2.1 Jet Printing (Non-contact Printing)
9.2.1.1 Inkjet printing
9.2.1.2 Aerosol-jet printing
9.2.1.3 Electrohydrodynamic-jet printing
9.2.2 Replicate Printing (Impact Printing)
9.2.2.1 Screen printing
9.2.2.2 Gravure printing
9.2.2.3 Flexographic printing
9.2.2.4 Offset printing
9.2.2.5 Roll-to-roll printing
9.3 Printable Inks
9.3.1 Metal Materials
9.3.2 Transparent Conducting Oxide Inks
9.3.3 Carbon Nanomaterials
9.3.4 Semiconductor Nanomaterials
9.3.5 Reactive Inks
9.3.6 Stretchable Inks
9.4 Post-printing Process
9.4.1 Thermal Sintering
9.4.2 Photonic Sintering
9.4.3 Plasma, Microwave, and Electrical Sintering
9.5 Applications
9.5.1 Transparent Conductive Films
9.5.2 Printed TFTs
9.5.3 Printed Solar Cells
9.5.4 Printed OLEDs
9.5.5 Printed Stretchable Circuits
9.6 Summary
10: Mechanics and Control of Smart Flexible Structures
10.1 Introduction
10.2 Wavy Designs
10.2.1 Small Deformations of Wavy Ribbons
10.2.2 Large Deformations of Wavy Ribbons
10.2.3 Partially Boned Wavy Ribbons
10.2.4 Wavy Membranes
10.3 Island-Bridge Designs
10.3.1 Straight Interconnects
10.3.2 Serpentine Interconnects
10.3.3 Fractal Interconnects
10.4 Origami/Kirigami Designs
10.5 Conclusion
Index