Flattening ability of a vacuum pin chuck around the periphery of a processed wafer

✍ Scribed by A. Une; Y. Kai; M. Mochida; S. Matsui

• Book ID: 114155244
• Publisher: Elsevier Science
• Year: 2001
• Tongue: English
• Weight: 440 KB
• Volume: 57-58
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/s0167-9317(01)00428-2