First-Principles Analyses and Predictions on the Reactivity of Barrier Layers of Ta and TaN toward Organometallic Precursors for Deposition of Copper Films

✍ Scribed by Machado, Eduardo; Kaczmarski, Marcin; Ordejón, Pablo; Garg, Diwakar; Norman, John; Cheng, Hansong

• Book ID: 126436901
• Publisher: American Chemical Society
• Year: 2005
• Tongue: English
• Weight: 546 KB
• Volume: 21
• Category: Article
• ISSN: 0743-7463
• DOI: 10.1021/la050164z