𝔖 Bobbio Scriptorium

✦ LIBER ✦

First announcement of the seventh international conference: Paris, France, 9–13 September 1974 and Invitation for Submission of Papers to the Conference

Book ID: 119012217
Publisher: IWA Publishing
Year: 1973
Tongue: English
Weight: 426 KB
Volume: 7
Category: Article
ISSN: 0043-1354
DOI: 10.1016/0043-1354(73)90187-5

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

International Association on Water Pollu

International Association on Water Pollution Research (IAWPR) : Technical Program of the Seventh Conference, Paris. 9–13 September 1974

📂 Article 📅 1974 🏛 IWA Publishing 🌐 English ⚖ 24 KB

[IEEE 13th International Conference on,

[IEEE 13th International Conference on, Intelligent Systems Application to Power Systems - Arlington, Virginia, USA (Nov. 6-10, 2005)] Proceedings of the 13th International Conference on, Intelligent Systems Application to Power Systems - Concepts and Approaches in Multi-Agent Systems for Power Applications, (Invited Paper)

✍ McArthur, S.D.J.; Davidson, E.M. 📂 Article 📅 2005 🏛 IEEE ⚖ 356 KB

[IEEE 2011 11th Annual International Con

[IEEE 2011 11th Annual International Conference on New Technologies of Distributed Systems (NOTERE) - Paris, France (2011.05.9-2011.05.13)] 2011 11th Annual International Conference on New Technologies of Distributed Systems - AVATAR: A SysML Environment for the Formal Verification of Safety and Security Properties

✍ Pedroza, Gabriel; Apvrille, Ludovic; Knorreck, Daniel 📂 Article 📅 2011 🏛 IEEE ⚖ 217 KB

[IEEE The 13th International Conference

[IEEE The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. - Seoul, Korea (June 5-9, 2005)] The 13th International Conference on Solid-State Sensors, Actuators and Microsystems, 2005. Digest of Technical Papers. TRANSDUCERS '05. - Polysilicon packaging and a new anchoring technology for thick SOI MEMS - dynamic response model and application to over-damped inertial sensors

✍ Diem, B.; Barbe, J.C.; de Crecy, F.; Giroud, S.; Renaud, D.; Grange, H.; Hammond 📂 Article 📅 2005 🏛 IEEE ⚖ 608 KB