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Finite-element analysis of superconducting microstrip line for mmic applications

✍ Scribed by D. Kinowski; P. Pribetich; P. Kennis

Book ID
112145817
Publisher
John Wiley and Sons
Year
1992
Tongue
English
Weight
301 KB
Volume
5
Category
Article
ISSN
0895-2477

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## Abstract This paper presents optimization of GaAs substrate thickness for GaAs‐MMIC processes at high frequencies using a multidielectric microstrip line, that is fabricated using MMIC process. The spectral‐domain technique is used for the theoretical evaluation of the characteristic parameters