Optimization of substrate thickness in GaAs MMICs for high-frequency applications: Using microstrip line
✍ Scribed by Jay Prakash Thakur; A. K. Pandey; Ashutosh Kedar; K. K. Gupta; H. P. Vyas
- Publisher
- John Wiley and Sons
- Year
- 2004
- Tongue
- English
- Weight
- 85 KB
- Volume
- 41
- Category
- Article
- ISSN
- 0895-2477
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✦ Synopsis
Abstract
This paper presents optimization of GaAs substrate thickness for GaAs‐MMIC processes at high frequencies using a multidielectric microstrip line, that is fabricated using MMIC process. The spectral‐domain technique is used for the theoretical evaluation of the characteristic parameters of the microstrip line. The theoretical analysis is validated by the corresponding study, which was conducted using the high‐frequency structure simulator (HFSS). Some of the results are also verified with the measured results. This work is useful for inhouse optimization of substrate thickness for various GaAs‐MMIC foundries. © 2004 Wiley Periodicals, Inc. Microwave Opt Technol Lett 41: 63–66, 2004; Published online in Wiley InterScience (www.interscience.wiley.com). DOI 10.1002/mop.20047