𝔖 Bobbio Scriptorium
✦   LIBER   ✦

Finding Applications for Materials

✍ Scribed by D. Landru; Y. Bréchet; M.F. Ashby


Publisher
John Wiley and Sons
Year
2002
Tongue
English
Weight
169 KB
Volume
4
Category
Article
ISSN
1438-1656

No coin nor oath required. For personal study only.


📜 SIMILAR VOLUMES


Shape Memory Materials for Biomedical Ap
✍ F. El Feninat; G. Laroche; M. Fiset; D. Mantovani 📂 Article 📅 2002 🏛 John Wiley and Sons 🌐 English ⚖ 302 KB 👁 1 views

Shape memory properties provide a very attractive insight into materials science, opening unexplored horizons and giving access to unconventional functions in every material class (metals, polymers, and ceramics). In this regard, the biomedical field, forever in search of materials that display unco

Selection of Applications for a Material
✍ A. Salimon; Y. Bréchet; M.F. Ashby; A.L. Greer 📂 Article 📅 2004 🏛 John Wiley and Sons 🌐 English ⚖ 218 KB 👁 1 views

## Abstract Finding an application for a given (not necessarily new) material is an elusive problem. Methods for material selection to fill a given application are now well developed. But the inverse problem – that of finding applications for a new material – has no such established methodology. Th

Organic/inorganic composite materials fo
✍ Jeng-I Chen; Ratcharoj Chareonsak; Vuthipong Puengpipat; Sutiyao Marturunkakul 📂 Article 📅 1999 🏛 John Wiley and Sons 🌐 English ⚖ 151 KB 👁 1 views

A new organic/inorganic coating material based on the modification of a conventional melamine/polyol system has been developed. Polyhydroxyethylmethacrylate functionalized with alkoxysilane group was mixed with hexamethoxymethylmelamine. Upon heating under an acid catalyzed condition, both sol-gel r

Thermal Management Materials for High-Pe
✍ A. Luedtke 📂 Article 📅 2004 🏛 John Wiley and Sons 🌐 English ⚖ 90 KB

A main issue of the radio frequency power amplifier semiconductor components for base stations is the large amount of thermal energy created by the semiconductor. Packaging technology including heat dissipation is a critical element in nearly all new chip generations, caused by a power multiplicatio