Filling trenches on a SiO2 substrate with Cu using a hot refractory anode vacuum arc

✍ Scribed by I.I. Beilis; D. Grach; A. Shashurin; R.L. Boxman

• Publisher: Elsevier Science
• Year: 2008
• Tongue: English
• Weight: 499 KB
• Volume: 85
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2008.04.018