Filling of nanoscale holes with high aspect ratio by Cu electroplating using suspension of supercritical carbon dioxide in electrolyte with Cu particles

✍ Scribed by Shinoda, Nao; Shimizu, Tetsuya; Chang, Tso-Fu Mark; Shibata, Akinobu; Sone, Masato

• Book ID: 118746467
• Publisher: Elsevier Science
• Year: 2012
• Tongue: English
• Weight: 731 KB
• Volume: 97
• Category: Article
• ISSN: 0167-9317
• DOI: 10.1016/j.mee.2012.02.031