Cu electroplating using suspension of supercritical carbon dioxide in copper-sulfate-based electrolyte with Cu particles

✍ Scribed by Shinoda, Nao; Shimizu, Tetsuya; Chang, Tso-Fu Mark; Shibata, Akinobu; Sone, Masato

• Book ID: 123274388
• Publisher: Elsevier Science
• Year: 2013
• Tongue: English
• Weight: 1018 KB
• Volume: 529
• Category: Article
• ISSN: 0040-6090
• DOI: 10.1016/j.tsf.2012.03.089