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Field application of a dynamic thermal circuit rating method

✍ Scribed by Douglass, D.A.; Edris, A.A.; Pritchard, G.A.

Book ID
111966067
Publisher
IEEE
Year
1997
Tongue
English
Weight
865 KB
Volume
12
Category
Article
ISSN
0885-8977

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This paper presents dynamic thermal analyses of a power integrated circuit with a cooling assembly. The investigations are based on the examination of the cumulative and differential structure functions obtained from the circuit cooling curves recorded during transient circuit temperature measuremen