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Dynamic thermal modelling of a power integrated circuit with the application of structure functions

✍ Scribed by Marcin Janicki; Jedrzej Banaszczyk; Gilbert De Mey; Marek Kaminski; Bjorn Vermeersch; Andrzej Napieralski

Publisher
Elsevier Science
Year
2009
Tongue
English
Weight
629 KB
Volume
40
Category
Article
ISSN
0026-2692

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✦ Synopsis

This paper presents dynamic thermal analyses of a power integrated circuit with a cooling assembly. The investigations are based on the examination of the cumulative and differential structure functions obtained from the circuit cooling curves recorded during transient circuit temperature measurements. The experiments carried out and the comprehensive study of the computed structure functions rendered possible determination of the interface contact resistance and the heat transfer coefficient values necessary for numerical thermal simulations illustrating the influence of these thermal model parameters on circuit temperature.

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