Fatigue crack propagation behavior of lead-free solder joints under high-strain-rate cyclic loading

✍ Scribed by S.K.W. Seah; E.H. Wong; V.P.W. Shim

• Book ID: 113897542
• Publisher: Elsevier Science
• Year: 2008
• Tongue: English
• Weight: 339 KB
• Volume: 59
• Category: Article
• ISSN: 1359-6462
• DOI: 10.1016/j.scriptamat.2008.08.020