Addendum to “fatigue crack propagation life analysis of solder joints under thermal cyclic loading” [Theoretical and applied fracture mechanics 24 (1996) 157–164]

✍ Scribed by R.M.V. Pidaparti; X. Song

• Publisher: Elsevier Science
• Year: 1996
• Tongue: English
• Weight: 38 KB
• Volume: 25
• Category: Article
• ISSN: 0167-8442
• DOI: 10.1016/0167-8442(96)00010-9