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Failure analysis of power modules: a look at the packaging and reliability of large IGBTs

✍ Scribed by Lambilly, H.D.; Keser, H.O.

Book ID: 114560445
Publisher: IEEE
Year: 1993
Tongue: English
Weight: 873 KB
Volume: 16
Category: Article
ISSN: 0148-6411
DOI: 10.1109/33.237930

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