✦ LIBER ✦
Failure analysis of power modules: a look at the packaging and reliability of large IGBT's : Herve de Lambilly and Helmut O. Keser. IEEE Transactions on Components, Hybrids and Manufacturing Technology, 16(4), 412 (June 1993)
- Publisher
- Elsevier Science
- Year
- 1994
- Tongue
- English
- Weight
- 106 KB
- Volume
- 34
- Category
- Article
- ISSN
- 0026-2714
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