Ultrasonic bonding of integrated circuit
✦ LIBER ✦
Factors affecting solder wetting and resistance drift in thick film circuits : L. H. Fanelli, W. L. Robinson and V. J. Leggio, Proc. 1969 Electron. Compon. Conf., Washington D.C., 30 April–2 May (1969), p. 329
- Publisher
- Elsevier Science
- Year
- 1969
- Tongue
- English
- Weight
- 105 KB
- Volume
- 8
- Category
- Article
- ISSN
- 0026-2714
No coin nor oath required. For personal study only.
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