Fabrication of two-layer flexible copper clad laminate by electroless-Cu plating on surface modified polyimide

✍ Scribed by Soo-Min HWANG; Jun-Hyung LIM; Chang-Min LEE; Eui-Cheol PARK; Jun-Hyuk CHOI; Jinho JOO; Hoo-Jeong LEE; Seung-Boo JUNG

• Book ID: 117693779
• Publisher: Elsevier Science
• Year: 2009
• Tongue: English
• Weight: 344 KB
• Volume: 19
• Category: Article
• ISSN: 1003-6326
• DOI: 10.1016/s1003-6326(08)60388-x