Fabrication of Molded Interconnection Devices by Ultrasonic Hot Embossing on Thin Polymer Films

✍ Scribed by Khuntontong, P.; Blaser, T.; Schomburg, W.K.

• Book ID: 119816553
• Publisher: IEEE
• Year: 2009
• Tongue: English
• Weight: 765 KB
• Volume: 32
• Category: Article
• ISSN: 1521-334X
• DOI: 10.1109/tepm.2009.2020742