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Fabrication of interconnects using pressureless low temperature sintered Ag nanoparticles

✍ Scribed by Shuai Wang; Hongjun Ji; Mingyu Li; Chunqing Wang


Book ID
116730896
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
423 KB
Volume
85
Category
Article
ISSN
0167-577X

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