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Fabrication of discretep-njunctions separated by an insulating layer using direct wafer bonding

✍ Scribed by E. G. Guk; B. G. Podlaskin; N. A. Tokranova; V. B. Voronkov; V. A. Kozlov

Book ID: 110120142
Publisher: Springer
Year: 1999
Tongue: English
Weight: 144 KB
Volume: 33
Category: Article
ISSN: 1063-7826
DOI: 10.1134/1.1187787

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