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Experimental and computational study of the morphological evolution of intermetallic compound (Cu6Sn5) layers at the Cu/Sn interface under isothermal soldering conditions

✍ Scribed by M.S. Park; M.K. Stephenson; C. Shannon; L.A. Cáceres Díaz; K.A. Hudspeth; S.L. Gibbons; J. Muñoz-Saldaña; R. Arróyave

No coin nor oath required. For personal study only.

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