✦ LIBER ✦

EXAFS investigation of interdiffusive kinetics in CuAu thin films

✍ Scribed by Corni, P. ;Antonini, G. M.

Publisher: John Wiley and Sons
Year: 1986
Tongue: English
Weight: 186 KB
Volume: 97
Category: Article
ISSN: 0031-8965
DOI: 10.1002/pssa.2210970138

No coin nor oath required. For personal study only.

📜 SIMILAR VOLUMES

Resistometric investigation of initial i

Resistometric investigation of initial interdiffusion in AgAu thin film couples

✍ Wagendrstel, A. 📂 Article 📅 1975 🏛 John Wiley and Sons 🌐 English ⚖ 522 KB

Ion back-scattering analysis of interdif

Ion back-scattering analysis of interdiffusion in Cu-Au thin films

✍ J.A. Borders 📂 Article 📅 1973 🏛 Elsevier Science 🌐 English ⚖ 623 KB

AES depth profile studies of interdiffus

AES depth profile studies of interdiffusion in the AgCu bilayer and multilayer thin films

✍ Bukaluk, A. 📂 Article 📅 1990 🏛 John Wiley and Sons 🌐 English ⚖ 501 KB

Investigation of reactive diffusion in t

Investigation of reactive diffusion in the thin-film system CuTi

✍ Gershinskii, A. E. ;Khoromenko, A. A. ;Cherepov, E. I. 📂 Article 📅 1975 🏛 John Wiley and Sons 🌐 English ⚖ 631 KB

Investigation of interdiffusion in coppe

Investigation of interdiffusion in copper–nickel bilayer thin films

✍ Ahmed M. Abdul-Lettif 📂 Article 📅 2007 🏛 Elsevier Science 🌐 English ⚖ 186 KB

Auger depth profiling technique and X-ray diffraction analysis have been employed to study the interdiffusion in vacuum-deposited copper-nickel bilayer thin films. An adaptation of the Whipple model was used to determine the diffusion coefficients of both nickel in copper and copper in nickel. The c

Measurements of interdiffusivities in Cu

Measurements of interdiffusivities in Cu/NiFe ternary alloy thin films

✍ J. Chaudhuri; T. Tsakalakos 📂 Article 📅 1985 🏛 Elsevier Science ⚖ 556 KB