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Evolution of microstructure and electrical conductivity of electroless copper deposits on a glass substrate

✍ Scribed by Xiaoyun Cui; David A. Hutt; Paul P. Conway

Book ID
113937736
Publisher
Elsevier Science
Year
2012
Tongue
English
Weight
753 KB
Volume
520
Category
Article
ISSN
0040-6090

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## Abstract A one‐step electroless deposition method was developed to synthesize sponge‐like copper film with favourable mechanical adhesion on silicon substrate. X‐ray diffraction and X‐ray photoelectron spectroscopy analysis and field emission scanning electron microscopy observations indicate th